Development board based on the TMS320F28335 DSP for applications of power electronics
This paper presents the design of a special purpose development board for power applications based on the digital signal processor (DSP) TMS320F28335. We also propose some considerations for the design of any four-layer printed circuit line with international recommendations to counteract the EMI (electromagnetic interference) and increase the EMC (electromagnetic compatibility). Additionally, the main features of each module on the board and their respective conditioning circuits designed are presented in order for the development board to be useful for any application of power electronics as motor control, switching power supplies, LED lighting, communications through the electric network, etc. Finally, a test protocol to verify the performance of the card and the comparison between the final cost per unit and similar cards on the market were performed.
Varun, R. Prakash, and I. K. Bhat, “Energy, economics and environmental impacts of renewable energy systems ,” Renewable and Sustainable Energy Reviews , vol. 13, no. 9, pp. 2716 – 2721, 2009.
P. K. Steimer, “Enabled by high power electronics-Energy efficiency, renewables and smart grids,” in Power Electronics Conference (IPEC), 2010 International, pp. 11–15, 2010.
Y. Huang, J. Li, and R. Gong, “A novel SVPWM control Stand-alone Three-phase PV power system based on TMS320F28335,” in Consumer Electronics, Communications and Networks (CECNet), 2012 2nd International Conference on, pp. 3059–3062, 2012.
J. Salazar, “Procesadores digitales de señal (DSP),” Mundo electrónico, no. 314, pp. 46–57, 2000.
T. Instrument, “Data manual TMS320F28335, TMS320F28334, TMS320F28332, TMS320F28235, TMS320F28234, TMS320F28232, Digital Signal Controllers (DSCs),” 2007.
P. M. Embree, C algorithms for real-time DSP. Prentice Hall PTR, p. 7, 1995.
K. C. S. Adel S. Sedra, Circuitos Microelectrónicos, 4th ed. McGraw-Hill, pp. 929–960, 1999.
H. G. Dimopoulos, Analog Electronic Filters: Theory, Design and Synthesis. Springer, p. 47, 2011.
K. C. S. Adel S. Sedra, Circuitos Microelectrónicos, 4th ed. McGraw-Hill, p. 939, 1999.
W. Saraga, “Sensitivity of 2nd-order Sallen-key-type active RC filters,” Electronics Letters, vol. 3, no. 10, pp. 442 –444, 1967.
W.-K. Chen, Passive, Active, and Digital Filters , 3rd ed. CRC Press, p. 1-17, 2009.
F. Miyara, Filtros Activos, 2nd ed, p. 5, 2004.
P. Horowitz and W. Hill, The Art of Electronics, 2nd ed., no. v. 816. Cambridge University Press, p. 271, 1989.
M. Thompson, Intuitive Analog Circuit Design. Newnes, p. 395, 2006.
J. L. D. Barragán, “Acondicionamiento de MFilters,” 2003.
S. Muralikrishna and S. Sathyamurthy, “An overview of digital circuit design and PCB design guidelines - An EMC perspective,” Electromagnetic Interference Compatibility, 2008. INCEMIC 2008. 10th International Conference on, pp. 567–573, 2008.
N. L. Eastman, “Considerations for mixed analog/digital PCB design,” WESCON/96, pp. 297–301, 1996.
J. Jing and K. Lingwen, “Study of signal integrity for PCB level,” Electronic Packaging Technology High Density Packaging (ICEPT-HDP), 2010 11th International Conference on, pp. 828–833, 2010.
F. A. R. C. L. T. J Lopez Sanchez and J.A.guacaneme, “Recomendaciones para el diseño de circuitos impresos de potencia,” REVISTA CIENTÍFICA Y TECNOLÓGICA DE LA FACULTAD DE INGENIERÍA UNIVERSIDAD DISTRITAL FRANCISCO JOSÉ DE CALDAS, vol. 9, no. 2, pp. 44–47, 2003.
K. Y. See, M. Oswal, W. Khan-ngern, F. Canavero, C. Christopoulos, and H. Grabinski, “Impact of PCB layout design on final product’s EMI compliance,” Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on, pp. 553–556, 2006.
P. Chand, B. N. Gangopadhyay, and M. Kumar, “PCB layout design for EMI/EMC compliance,” ElectroMagnetic Interference and Compatibility (INCEMIC), 2006 Proceedings of the 9th International Conference on, pp. 19–24, 2006.
- There are currently no refbacks.
Copyright (c) 2015 TECCIENCIA